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CERASOLZER
Characteristics | Fluxless | No flux required |
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Adhesion | Direct bonding to glass, ceramic, and hard-to-solder metals | |
Conductivity | Excellent electrical conductivity | |
Seals | Hermetic seals between glass, ceramic and metals |
Applications | Displays | No flux required |
---|---|---|
Glass | LCD | |
Fiber optics | ||
Solar Panels & Batteries | ||
Lenses | ||
Conductivity | Piezo Crystals | |
Metal Oxides | ||
Metals | Magnets | |
Semi-conductors | ||
Sputtering targets | ||
Fuel Cells | ||
Silicon Wafers | ||
Metallic Textiles and Weaves |
Cerasolzer | Lead-Base |
C297 | 297C | For a strong bond with difficult-to-solder glass, ceramic and metals such as aluminum |
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Replaced by E217 | ||||
Replaced by E217 | ||||
C186 | 186C | For glass, ceramic and metals such as stainless steel | ||
Cerasolzer Eco | Lead-Free |
E217 | 217C | For glass, ceramic or hard-to-solder metals |
E182 | 182C | For glass, ceramic or hard-to-solder metals | ||
E155 | 155C | For glass, ceramic or hard-to-solder metals |
Note: For best results, we recommend using Cerzsolzer with the Sunbonder ultrasonic soldering device.